Exploration of Ring Oscillator Based Temperature Sensors Network Accuracy on FPGA

During the last decades, technology scaling in reconfigurable logic devices enabled implementing complicated designs which results in higher power density and on-chip temperature. Since higher operating temperature of chips is a critical problem in electronics devices, thermal management techniques are highly required. To provide a thermal map of reconfigurable logic devices, a network of sensors is needed. In this work, a ring-oscillator-based temperature sensor is used to create a sensor network. Then, a design space exploration is done among several sensor networks with the various sensor configurations including different ring oscillator length, the number of sensors in the examined network and various sampling time. We propose three criteria for exploring and comparing the efficiency of sensors network based on the thermal overhead and also measurement accuracy and precision among plenty of configurations on the Virtex-6 FPGA

Inherent Uncertainty in the Determination of Multiple Event Cross Sections in Radiation Tests

In radiation tests on SRAMs or FPGAs, two or more independent bitflips can be misled with a multiple event if they accidentally occur in neighbor cells. In the past, different tests such as the ``birthday statistics'' have been proposed to estimate the accuracy of the experimental results. In this paper, simple formulae are proposed to determine the expected number of false 2-bit and 3-bit MCUs from the number of bitflips, memory size and the method used to search multiple events. These expressions are validated using Monte Carlo simulations and experimental data. Also, a technique is proposed to refine experimental data and thus partially removing possible false events. Finally, it is demonstrated that there is a physical limit to determine the cross section of memories with arbitrary accuracy from a single experiment

Single Event Upsets under 14-MeV Neutrons in a 28-nm SRAM-based FPGA in Static Mode

A sensitivity characterization of a Xilinx Artix-7 FPGA against 14.2 MeV neutrons is presented. The content of the internal SRAMs and flip-flops were downloaded in a PC and compared with a golden version of it. Flipped cells were identified and classified as cells of the configuration RAM, BRAM, or flip-flops. SBUs and MCUs with multiplicities ranging from 2 to 8 were identified using a statistical method. Possible shapes of multiple events are also investigated, showing a trend to follow wordlines. Finally, MUSCA SEP3 was used to make assesment for actual environments and an improvement of SEU injection test is proposed

SEE sensitivity of a COTS 28-nm SRAM-based FPGA under thermal neutrons and different incident angles

This paper provides an experimental study of the single-event upset (SEU) susceptibility against thermal neutron radiation of a 28-nm bulk Commercial-Off-The-Shelf (COTS) Xilinx Artix-7 FPGA under different angles of incidence. Experimental results indicating SEUs on configuration RAM (CRAM) cells, Flip-Flops (FFs), and Block RAMs (BRAMs) are presented and discussed. Shapes of multiple events (ranging from 2 to 12-bit) are also analyzed, and their dependency on the incident angle of the particle beam against the device’s surface. Possible shapes of 128 and 384-bit multiple events are also investigated, revealing a trend to follow word lines. The results of the front incident angle are compared with 14.2-MeV neutrons, demonstrating a considerable difference in the device’s sensitivity against both irradiation sources. Finally, a modeling tool called MUSCA-SEP3 is used to predict the device’s sensitivity under the same environmental conditions. The obtained experimental results will show a good agreement with the predicted ones in a very accurate way

Experimental and Analytical Study of the Responses of Nanoscale Devices to Neutrons Impinging at Various Incident Angles

In harsh radiation environments, it is well known that the angle of incidence of impinging particles against the surface of the operating devices has significant effects on their sensitivity. This article discusses the sensitivity underestimations that are made if particle isotropy is not taken into account, by means of an analytical study made with a single-event upset predictive platform. To achieve this goal, experimental results carried out with a commercial-off-the-shelf (COTS) bulk 130-nm nonvolatile static random access memory (SRAM) for various incident angles on 14.2 MeV neutrons are first discussed. Then, a modeling tool called multiscales single-event phenomena predictive platform (MUSCA-SEP3) is used to predict the sensitivity of this memory under the same environmental conditions. Predictions and experimental results will be cross-checked, and therefore, the feasibility of this tool will be demonstrated for testing any other incident angle. Finally, an isotropic environment and an XY SRAM array will be emulated with MUSCA in order to demonstrate that the asymmetrical cross sections that were observed experimentally for various incidence angles are due to the underlying asymmetry of the metalization/passivation layers within the device with respect to its active silicon. Conclusions will finally be drawn as for the importance of taking into account particle isotropy in radiation-ground tests

Single Event Upsets Under Proton, Thermal, and Fast Neutron Irradiation in Emerging Nonvolatile Memories

In New Space, the need for reduced cost, higher performance, and more prompt delivery plans in radiation-harsh environments have motivated spacecraft designers to use Commercial-Off-The-Shelf (COTS) memories and emerging technology devices. This paper investigates the behavior of state-of-the-art memories manufactured in emerging technologies, including Ferroelectric Random-Access Memory (FRAM), Resistive Random-Access Memory (ReRAM), and Magnetic Random-Access Memory (MRAM), against radiation effects in static and dynamic modes. Radiation-ground tests were conducted under 15-MeV and 1-MeV protons, thermal and 14.8-MeV neutrons leading to various categories of radiation effects. Experimental results will show clear evidence of the robustness of bitcells manufactured using these emerging technologies against radiation, but at the same time, some susceptibility in these devices to suffer radiation effects when working in dynamic mode. Experimental results with the CY15B102Q and CY15B104Q FRAMs (Infineon Technologies), the MB85AS4MT, and MB85AS8MT ReRAMs (Fujitsu), and the MR10Q010CSC and MR25H40CDF MRAMs (Everspin) will be presented and discussed